Rubber chip suction nozzle is an important component for SMT mounter, which can suck and place electronic components on the PCB board. Rubber chip suction nozzles need to be cleaned and tested regularly to ensure the quality and efficiency of mounting. Laser drilling is a technology used to make fine holes on the rubber chip suction nozzle, which has the advantages of high precision, fast speed, smooth, burr-free, pollution-free and so on. Laser drilling equipment mainly includes laser, optical system, motion control system, detection system and so on. The type and power of the laser will affect the effectiveness and efficiency of the drilling. Our company uses a picosecond laser to focus the laser beam on the surface of the suction nozzle to form a high-energy density spot. The auxiliary fixture is designed to control the relative position of the suction nozzle and the laser head through the motion system and the visual capture function, so as to achieve a through hole with an aperture size of 0.1 ± 0.005 mm, a hole depth of 0.25 mm and a concentricity of less than 0.02 mm.

According to the results of microscopic observation, there is no obvious residue in the cutting hole, and the edge is smooth:

After the extrusion test, there is no obvious crack on the edge of the hole, dirt will enter the hole on the upper surface during extrusion, most of which can be blown away by air blowing, and some residues can be removed by ultrasonic cleaning.