3C Electronic

Multilayer co-fired ceramics is an advanced technology for manufacturing modern microelectronic multilayer electrical interconnect substrates and package shells, including low-temperature co-fired ceramics LTCC and high-temperature co-fired ceramics HTCC, which are widely used in 3C electronics industry.

Boyi Laser provides high precision laser processing equipment for LTCC/HTCC raw porcelain chips, which can form various diameter through holes on raw porcelain chips according to application requirements, including square holes and shaped holes, the minimum diameter can be achieved 50-100 μm, roundness is better than 0.01 mm drilling requirements.