With the rapid development of electronic information, the demand for high-density and miniaturized packaging has put forward more stringent requirements for the preparation and processing technology of ceramic substrates and shells. As a circuit substrate material, it is necessary to use mechanical or laser drilling, micropore grouting, precision conductor paste printing and other processes to produce circuit patterns on the raw ceramic tape. As a key link in the manufacturing process of multilayer ceramic packaging technology, the via size and position accuracy of green tape directly affect the yield and final electrical performance of the substrate. 

The conventional mechanical punch pin is usually suitable for the processing of through holes with a diameter of 0. 15 mm and above, while for the processing of through holes with a diameter of less than 0. 15 mm, there are mechanical defects such as low drilling efficiency, difficulty in drilling through holes, and residual broken porcelain in the holes. By use that laser proces, the processing aperture can be flexibly set without being limited by the specification of the punch needle, and the processing stress is reduced. In recent years, picosecond laser has become a sharp tool for laser drilling of raw ceramic chips by virtue of its advantages of short pulse width, high peak power, small thermal effect and high processing resolution, which are different from long pulse laser. 

At present, our company has developed ultraviolet picosecond LTCC/HTCC laser drilling equipment with terminal customers, with high-precision visual positioning function, external blowing and dust collection system, and automatic cleaning function, which greatly improves the efficiency of dust removal, saves the time cost and labor cost of manual cleaning, and successfully solves the problem of poor roundness and taper of laser processing pores. As well as surface slag, ablation and other technical problems. Fig. a and Fig. b show the window opening and drilling processing effects of some HTCC and LTCC. The diameter difference between the front and back of the round hole is 5-10 um, the roundness is better than 0.01 mm, and there is no obvious blackening on the side wall under the microscope. The results were published in Lasers in in Lasers in Manufacturing Conference 2023 (LiM 2023), and the details can be found in the link https://www.wlt.de/lim-conference. 

The equipment can realize the high-precision control of the hole diameter and position in the LTCC/HTCC process, achieve the effects of high processing efficiency, uniform hole diameter, smooth hole edge, no slag and no burn mark, effectively boost the high-quality development of the domestic LTCC/HTCC multilayer ceramic industry, and promote the development of military electronic components in the direction of miniaturization and multi-function. In addition, this project has been supported by the special fund for economic construction, GF construction and RH development of Anhui Province in 2023.

Welcome to call: 17344079671 (Dr. Hu).