Laser Cut
This equipment is mainly used for HTCC<CC cutting and punching.
Equipment features:
1. The product meets the demand of 170*170 mm (can be customized);
2.X axis, Y axis: 4μm, Z axis: 10μm;
3.Stage flatness ≤50um;
4. Laser selection UV picosecond 30W;
5.Stable operation machining accuracy < ±5um;
6.Automatic loading and unloading selection;
7.X axis, Y1 axis, Y2 axis: 1m/s, Z axis: 0.5m/s;
8. Vacuum system + automatic cleaning mechanism to solve the dust adhesion during processing.
Sample display：
