Laser Repair

This device is mainly used for the removal and repair of defective chips in

Mini-LED display panels. It can be applied to direct display and backlight 

modules, and is compatible with metal, PCB, and Glass substrate material 

chips for crystal removal and solidification.

Equipment features:

1. Fine grain removal/solidification: rectangular spot: 150 * 300um (optional);

2. Marble precision platform equipment, with a movement accuracy of ≤ 2um;

3. Double Dragon Gate achieves synchronous operation of crystal extraction 

and solidification, improving efficiency, with a beat of ≤ 35s/ea;

4. Adopting a laser heating/CCD/temperature control coaxial system to achieve 

real-time monitoring, with a temperature control accuracy of ≤ 0.3%;

5. Equipped with a solder pad self-cleaning system, achieving high automation 

of the equipment.

Operation process：

Operation video：