Laser Caving

This device is mainly used for laser engraving and slotting operations on the surface of wafers.

Equipment features:

1. Adopting short pulse nanosecond ultraviolet laser to better reduce deposition, thermal effects, and low burrs, greatly improving cutting quality;

2. Unique light control software technology, variable cutting slot width, and full cutting function corresponding to wafer products with a thickness of 200um, making applications more flexible and convenient;

3. Equipped with a dual CCD vision system, equipped with a 380 degree rotating motor, high-speed image recognition capability, automatic image recognition, edge recognition, notch inspection, Autocorrection cutting path position visual recognition processing;

4. Real time monitoring and feedback of laser power to ensure more stable laser power output;

5. Mobile repetition accuracy (≤ ± 1um);

6. Dual coating and cleaning system to improve equipment processing efficiency.