Laser Marker

This equipment is mainly used for laser marking operations on the surface of wafers

Equipment features:

1. High precision linear motor, high-speed X-Y motion platform, with a movement accuracy of ≤ 1um;

2. It can achieve wafer marking of 8-12 inches;

3. Double basket design, achieving no waiting for material replacement;

4. UV nanosecond laser, scanning speed max 12000mm/s;

5. WPH: 120.